ENSC495/851: Introduction to Microelectronic Fabrication

SFU Eng. Science Course Outline 98-1 (Spring)

(ENSC 495, 4 credits, split as 2-0-4: ENSC 851, 3 credits, 2- 0-1)

Description

This course gives students a hands-on introduction to Integrated Circuit Fabrication. The lectures introduce the theoretical background and application of each major IC fabrication processes: eg. oxidation, doping, depositions, photolithography and etching. Process simulation tools will be used throughout the course help understand each process. In parallel the laboratory gives practical experience of each process as part of an IC the students build from the bare silicon to final working device.

Professor:

Glenn Chapman, Rm ASB 8831, Phone: 291-3814, email: glennc@cs.sfu.ca

Laboratory Engineer

Bill Woods, Rm ASB 8832

Primary text:

"The Science and Engineering of Microelectronic Fabrication", Stephen Campbell, Oxford Univ. Press.

Other references:

"Microelectronic Processing", W.S. Ruska, McGraw-Hill.

"Silicon Processing, vol. 1", S. Wolf and R.N. Tauber, (Lattice Press).

Prerequisite:

The only prerequisites the students need are an understanding of basic transistor and diode operation. ENSC 222/ENSC 225 (Electronic Design I) or equivalent.

Lecture Schedule

Lecture Monday, Wednesday 17:30 - 18:50 pm, SCB8666

Week 1: Clean Room Technology and Silicon Wafer Production

Week 2: Thermal Oxidation

Week 3: Lithography

Week 4: Advanced Lithography

Week 5: Etching

Week 6: Etching II

Week 7: Diffusion Processes & Ion Implantation

Week 8: Thin Film Deposition: Evaporation and Sputtering

Week 9: Thin Film Deposition: Chemical Vapor Deposition

Week 10: Expitaxy CVD and Dry Etching Processes

Week 11: Packaging, Yields, Processing Facility Setup and Silicon Foundries

Week 12: CMOS and Bipolar Process Integration in practice

Week 13: Future of the processing & Project Presentations

Projects in Microfacation Lab (ASB 8823)

Students will work in 3-4 people teams which start with a bare silicon wafer and create finished IC's which include diodes, solar cells, transistors and some characterization test devices. All the process steps will be done by the students, who will also characterize the parameters for each step. Electrical characterization of the devices (diodes etc) will also be accomplished. Students get to keep samples of their own IC's.

Week 2: Tour of Microfabrication facilities (ASB 8823)

Week 3: Demonstration of laboratory processes

Week 3-5: Growth and patterning of oxide film on silicon.

Week 6-13: Build simple 3 level structures:

Graduate Students

Graduate students have two options. They can take the lab up to end of Week 5 and do the first report, and then do a Major processing project in the laboratory during the rest of the course. Alternatively they may do the entire laboratory like the undergraduate, with two Lab reports and a minor project (report on a processing area).

Mark Distribution

Student receive the highest of the following distributions:

ENSC 495

ENSC 851


Page maintained by: Prof. Glenn Chapman

Last updated Dec. 10, 1997