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Glenn H. Chapman
Assoc. Prof. Eng. Science

Dr. Glenn Chapman's main area of research is in Microelectronics, including Wafer Scale Integration, defect avoidance techniques, laser micromachining, micromachining, laser processing of materials, microfabrication, VLSI design, computer aided engineering, embedded microprocessor systems, anti-theft technology, and device physics.

Current Research Projects

Wafer Photo:
Wafer Scale Integrated 16 point FFT From M.I.T Lincoln Lab. Laser linking by G. Chapman, design by M. Rhodes (see reference) View enlarged image.
  • Laser applications for IC redundancy in building Wafer Scale Integration - Large Area Restructurable Silicon Systems
  • Laser applications in micromachining
  • Using micromachining techniques to create new sensors/actuators
  • Large area applications in both Wafer Scale Integration circuits and transducer arrays
  • Large area/Wafer Scale Integration Field Programmable Gate Arrays & Custom Computers
  • Laser applications to semiconductor processing
  • Microfabrication technology
  • Orbital Microfabrication
  • Laser applications to medical measurements for diagnosis and surgical correction
  • Embedded microprocessor systems
  • Computer Anti-Theft technology

Links To Other Descriptions of Research

Research Equipment

Laser Table equipment consists of a focused 5 watt argon ion laser beam (488/514 nm wavelength) with spot sizes down to 1 micron full width half maximum. An electro-optic shutter controls the beam pulse duration from single 2 microsecond pulse through to continuous exposure and multiple pulses. IC's are positioned below the beam using a laser interferometry controlled XY table with position accuracy of 0.1 micrometers over a 25x25 cm area. The table can move to locations and stabilize in less than 0.1 sec for distances less than 1 mm, and about 1 second for the full 25 cm. A TV camera image of the laser position area is displayed in the control system computer using a real time frame grabber on the TV microscope image. Digitally stored images can be taken of the cut points to verify the location of operations. IC's can be worked on in any of the following formats: chips or wafers, 24 or 40 pin DIPS, 64 pin-grid arrays. The combined laser, shutter and positioning system operates under a integrated MSWindows control system developed here at SFU. The system allows automatic moving to position, adjustment of the pulse parameters (duration, number of pulses, shape, etc.) and firing of the laser pulse. Scripts of control commands enable the table to move through a sequence of operations without needing any user input.

Microfabriction and micromachining research work at SFU's Microfabriction Laboratory including oxidation/doping furnaces, film RF sputter deposition system, photolithography, wet etching stations and inspection/measurement equipment.

Several 486 and Pentium class PC's for personal use of my Graduates students. Design work using SFU's VLSI Design facility with 2 Spark 10, 2 Spark 20 and one IPX file server. IC design with Cadence and Kic computer aided design tools. Analysis with Hspice circuit simulation, Ansys fine element program and Ssupreme4 processing simulation. Access to Canadian Microelectronic Corp.'s 3 micron, 1.2 micron, 0.8 micron and 0.5 mircon mulitproject wafer design submissions.

Recent Publications

Funding Support

Funding for this research comes from NSERC Operating grants, B.C. Advanced Systems Institute Senior Fellowship, and Centre for System Studies Strategic Studies grants, plus industrial research grants.

Industrial Partnerships

Industrial cooperation with the following firms in the area of microfabrication and micromachining:
  • Kinetic Sciences Inc., Vancouver, B.C.
    Successfully completed STEAR Phase I study on Advanced Tactile and Proximity Sensors for the Canadian Space Agency (CSA). Phase II project underway for advanced proximity/vision sensor invented during Phase I which is under patent application by the CSA.

  • Tantus Electronics and TRIUMF, Vancouver, B.C., with Dr. Martin Salomon.
    Development and prototyping of micro electrodes for Gas Strip Detectors. First generation microelectrodes have produced successfully working detectors, second/third generation under test. Cooperating with local companies for application in X-ray inspection systems.

  • Cooperation with Boeing Aircraft on the advantages of space manufacturing of microchips.

  • PMC-Serria, and Canadian Microelectronics Corporation.
    Development of laser microsurgery integrated circuit repair techniques, and their application in both chip repair or defect evaluation.

Related Courses

  • ENSC 461: Special Topics in Photonics and Laser Applications in Engineering
  • ENSC 351: Real Time Systems
  • ENSC 495:Special Project Lab in Introduction to Microelectronic Fabrication

Engineering Science
Simon Fraser University
8888 University Dr.
Burnaby, BC, V5A 1S6
Canada
Tel: 604-291-4371
Fax: (604) 291-4951

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