Prof. Glenn H. Chapman: SFU Eng. Science

Publications to Date

Total of 33 Journal, 124 Conference and 2 Book Chapter publications, plus 26 patents received or applied for.

Note: this section is under construction with abstracts in text and full papers in PDF format being added.  Currently the linked papers have the abstracts to read, grouped by topic, with already published papers linked to the full papers in PDF form to download.
Note: These papers are for academic use only and are not available for distribution or publication for other purposes.

Refereed Journal Papers

  1. F. Vasefi, M. Belton, B. Kaminska, G.H. Chapman,, and J.L.L. Carson, “Angular Domain Fluorescence Imaging for Small Animal Research”. accepted Journal of Biomedical Optics, 15(01), 016023-1 to 016023-5 2010
  2. F. Vasefi, E. Ng, B. Kaminska, G.H.Chapman, K.Jordan, and J.J. L. Carson, "Transmission and fluorescence angular domain optical projection tomography of turbid media," Appl. Opt. 48, 6448-6457 (2009)
  3. F. Vasefi, B. Kaminska, G.H. Chapman, and J.J. Carson “Image contrast enhancement in angular domain optical imaging of turbid media, Optics Express, Vol. 16 Issue 26, pp. 21492-21504 (2008)
  4. F. Vasefi, B. Kaminska, P.K.Y. Chan, and G.H. Chapman, “Multi-spectral Angular Domain Optical Imaging in Biological Tissues Using Diode Laser Sources”, Optics Express, Vol. 16 Issue 19, pp.14456-14468 (2008)
  5. N. Pfeiffer and G.H. Chapman, “Successive order, multiple scattering of two-term Henyey-Greenstein phase functions”, Optics Express, v16 Issue 18, pp.13637-13642 Sept. 2008.
  6. T. Schneider, H. Zhao, J.K. Jackson, G.H. Chapman, J. Dykes, U.O. Häfeli “Generation of biodegradable camptothecin-loaded polymer microspheres using hydrodynamic flow focusing”, J. Pharmaceutical Sciences, Sci 97, 4943-4954 2008.
  7. F. Vasefi, P.K.Y. Chan, B. Kaminska, G.H. Chapman, N. Pfeiffer, “An Optical Imaging Technique Using Deep Illumination in the Angular Domain”, IEEE J. Selected Topics in Quantum Electronics, v 13, pg 1610 – 1620, 2007
  8. M. Karimi, R. Tu, W. Lennard, G. H. Chapman, Karen L. Kavanagh, “Transparent Conducting Indium Bismuth Oxide”, Thin Solid Films, v515 (7), pg3760-5, 2007
  9. Y. Zhang, J. H. Choy, G. H. Chapman and K. L. Kavanagh, “Temporary Extrusion Failures in Accelerated Lifetime Tests of Copper Interconnects”, Elec. Dev. Let., v 26, pg 622-624, 2005.
  10. G.H. Chapman, Y. Audet, I. Koren, Z. Koren, S. Djaja, D.Y.H. Cheung, “Self-Correcting Active Pixel Sensor using Hardware and Software Correction”, IEEE Design and Test of Computers, v21, no. 6, pg 544-551, (Dec. 2004)
  11. G. H. Chapman, Member, IEEE, M. Trinh, N. Pfeiffer, G. Chu and D. Lee, "Angular Domain Imaging of Objects Within Highly Scattering Media Using Silicon Micromachined Collimating Arrays", IEEE J. Special Topics on Quantum Electronics, v9, no. 2, 257-266 (2003).
  12. M. Tank and G.H. Chapman, "Micromachined Silicon Collimating Detector Array to View Objects in Hightly Scattering Medium", Can Jour Elec. & Comp. Eng, .25, no. 1, 13-18 (Jan. 2000),
  13. G.H. Chapman and Benoit Dufort, "Using Laser Defect Avoidance to Build Large Area FPGA's", IEEE Design and Test, v5, 75-81, (Dec 1998)
  14. Y. Audet and G.H. Chapman, "Effects of Scanning and Biasing Circuit Restructuring on the Calibration of Large Area Magnetic Field Sensor Array", IEEE Tran. on Components Packaging and Manuf. Technology - Part B, v. 20, 342- 348 (1997)
  15. Y. Audet and G.H. Chapman, "Yield Improvement of a Large Area Magnetic Field Sensor Array using Redundancy Schemes", IEEE Tran. on VLSI Systems, v. 5, 28-33, (1997).
  16. B. Dufort and G.H. Chapman, "Test Vehicle for a Wafer-Scale Field Programmable Gate Array", IEEE Trans. on Components Packaging and Manuf. Technology - Part B, v. 18, 431-437 (1995)
  17. M. Salomon, J. Armitage, G.H. Chapman, M. Dixit, W. Faszer, J-L. Hamel and G. Oakham, "Passivation of Gas Microstrip Detectors and Long Term Operation Stability", Nuclear Instruments and Methods in Physics, A351, 313-316 (1994)
  18. G.H. Chapman, M.J. Syrzycki, L. Carr, and B. Dufort, "Test Vehicle for a Wafer-Scale Thermal Pixel Scene Simulator" IEEE Trans. on Components, Hybrids and Manuf. Technology Part B, Invited paper, v. 17, 334-341 (1994).
  19. M.J. Syrzycki, L. Carr, G.H. Chapman, and M. Parameswaran, "A Wafer- Scale Visual-to-Thermal Converter", IEEE Trans. on Components, Hybirds and Manuf. Technology, Invited paper, v. 16, 665-673 (1993).
  20. V. Ward, M.J. Syrzycki, and G.H. Chapman, "CMOS Photodetector with Built-In Light Adaptation Mechanism," Microelectronic Journal, 24, 547-553, (1993).
  21. Stoev, I., Surzycki, M., Parameswaran, M., Chapman, G., and Rawicz, A. "Process Optimization for Micromachined Silicon Non-Reverse Valve", Can. Jour. of Physics, 70, 881-885 (1992).
  22. G.H. Chapman, "Laser Interconnection Techniques for Defect Avoidance in Large Area Restructurable Silicon Systems", Microelectronic Journal, 23, 267- 272 (1992).
  23. G.H. Chapman, M. Parameswaran, and M.J. Syrzycki, "Wafer Scale Transducer Arrays", IEEE Computer, special issue on Wafer Scale Integration, v25, 4, 50- 56 (1992).
  24. S.S. Cohen, P.W. Wyatt, and G.H. Chapman, " Laser-Induced Melting of Thin Conducting Films: Part I - the Adiabatic Approximation", IEEE Trans. Elec. Dev., 38, 2042-2050 (1991).
  25. S.S. Cohen,  P.W. Wyatt, G.H. Chapman,  and J.M. Canter, "Melt-front velocity in laser-induced melting", J. Appl. Phys. v.67, 11, 6694-6700 (1990)
  26. S.S. Cohen, P.W. Wyatt, J.M. Canter, and G.H. Chapman, "The Resistance of Laser Diffused Links", IEEE Trans. on Elect. Dev., ED-36, 1220-1225 (1989).
  27. F.M. Rhodes, J.J. Dituri, G.H. Chapman, B.E. Emerson, A.M. Soares, and J.I. Raffel, "A Monolithic Hough Transform Processor Based on Restructurable VLSI", IEEE Trans. on Pattern Anal. Mech. Intell., 10, 1, 106- (1988).
  28. S.S. Cohen, P.W. Wyatt, G.H. Chapman, and J.M. Canter, "Laser Induced Diode Linking for Wafer-Scale Integration", IEEE Trans. on Elect. Dev., 35, 1533-1550 (1988).
  29. J.M. Canter, G.H. Chapman, B. Mathur, M.L. Naiman, and J.I. Raffel, "A Laser-Induced Ohmic link for Wafer Scale Integration in Standard CMOS Processing", 44th Annual Device Research Conference, paper VB-6, IEEE Trans. Elec. Dev., ED-33, 11, 1861 (1986).
  30. J.A. Burns, G.H. Chapman, and B.L. Emerson, "Programmable Connections Through Plasma Deposited Silicon Nitride", J. Electro-Chemical Soc., 86-2, 321- (1986).
  31. J.I. Raffel, A.H. Anderson, G.H. Chapman, K.H. Konkle, B. Mathur, A.M. Soares, and P.W. Wyatt, "A Wafer-Scale Digital Integrator Using Restructurable VLSI", IEEE Tran. on Elect. Dev., ED-32, 2, 479-486 (1985).
  32. J.I. Raffel, J.F. Freidin, and G.H. Chapman, "Laser Formed Connections Using Polyimide", Appl. Phys. Lett., 42, 705-706 (1983).
  33. J.A. Yasaitis, G.H. Chapman, and J.I. Raffel, "Low Resistance Laser Formed Lateral Links", IEEE Elect. Dev. Lett., EDL-3, 7, 184-186 (1982).
  34. G.H. Chapman, J.J. Loferski, J. Shewchun, R. Beaulieu, and B.K. Garside, "Cu(1-y) Ag(y) In S(2(1-x)) Se(2x) as a Prototype of the Pentenary Chalcopyrite Semiconductor System for Solar Photovoltaic Cells", Solar Energy Materials, 1, 2, 451-469 (1979).
  35. J. Shewchun, G.H. Chapman, J.J. Loferski, R. Beaulieu, and B.K. Garside, "The A1(1-y) B1y C3 D6(2x) E62(1-x) Pentenary Alloy Systems and Its Application to Photovoltaic Solar Energy Conversion", Jour. Appl. Phys., 50, 6978 (1979).
  36. G.H. Chapman, J. Shewchun, J.J. Loferski, B.K. Garside, and R. Beaulieu, "Lattice Constants and Band-Gap Variations of the Pentenary Semiconductor Systems Cu(1-y) Ag(y) In S(2(1-x)) Se(2x)", Applied Phys. Lett., 34, 11, 735- 737 (1979).
  37. J.J. Loferski, G.H. Chapman, J. Shewchun, S.D. Mittleman, E.A. De Meo, R. Arnott, H. L. Hwang, and R. Beaulieu, "Cathodoluminescence Characteristics of Cu(x)S Films Produced By Different Methods", Solar Energy Materials, 1, 1, 157- (1979).
  38. D.L. Atherton and G.H. Chapman, "Superconducing Cables and Future Power Transmission Techniques", Canadian Electrical Engineering Journal, 1, 2, 37- (1976).

Refereed Conference Proceedings

  1. G.H. Chapman, J. Leung, R. Thomas, I. Koren, and Z. Koren, “Correcting High Density Hot pixel defects in Digital Imagers”, Proc. SPIE Electronic Imaging: Image Sensors and Imaging Systems 2014, 9022, pp 90220G-1-0G-12, San Francisco, Feb 2014
  2. M. Mehran, J. Bryer, B. Gray and G.H. Chapman, “Modeling particle flow and blockages in microfluidic channels supported by periodic posts”, Proc. SPIE  Photonics West: Microfluidics, BioMEMS, and Medical Microsystems XII, 8976, pp 897604-1- 04-12, San Francisco, Feb 2014
  3. G.H. Chapman, R. Qarehbaghi, and Santiago Roche, “Calibrating Bimetallic Grayscale Photomasks to Photoresist Response for precise micro-optics fabrication”, Proc. SPIE Photonics West: Micromachining and Microfabrication Process Technology XIX, v. 8973, pp 897307-1-07-12, San Francisco, Feb 2014
  4. G.H. Chapman, J. Leung, R. Thomas, I. Koren, and Z. Koren, “Improved Image Accuracy in Hot Pixel Degraded Digital Cameras”, Proceedings IEEE Int. Symposium on Defect and Fault Tolerance, pp 172-177, New York, Oct. 2013
  5. G.H. Chapman, R. Thomas, I. Koren and Z. Koren, “Empirical formula for rates of hot pixel defects based on pixel size, sensor area and ISO”, Proc. Electronic Imaging, Sensors, Cameras, and Systems for Industrial/Scientific Applications XIII, v8659, 86590C-1-C-11, San Francisco, Jan 2013
  6. G.H. Chapman, J. Leung, R. Thomas, I. Koren and Z. Koren, “Relating digital imager defect rates to pixel size, sensor area and ISO”, Proc. IEEE Int. Symposium on Defect and Fault Tolerance, Huston, TX, 164-169 Oct. 2012.
  7. R. Qarehbaghi, and G.H. Chapman, “Bimetallic Grayscale Photomasks for Micro-optics Fabrication Using Dual Wavelength Laser Writing Techniques”, SPIE Photomask Technology, v8522, 85222K-1-K-12, Monterey, CA Sept. 2012.
  8. G.H. Chapman, I. Koren and Z. Koren, “Do More Camera Pixels Result in a Better Picture?”, IEEE 18th International On-Line Testing Symposium (IOLTS), 75-78, Sitges, Spain, June 2012
  9. G.H. Chapman, J. Leung, R. Thomas, I. Koren, and Z. Koren, “Projecting pixel defect rates based on pixel size, sensor area and ISO”, Proc. Electronic Imaging, Sensors, Cameras, and Systems for Industrial/Scientific Applications XII, v8298, 82980E-1-E-11, San Francisco, Jan 2012.
  10. R.L.K. Cheng, M.J. Phang, R.M. Thomas, N. Pfeiffer, G.H. Chapman, B. Kaminska, “Incoherent source angular domain imaging through complex three-dimensional scattering structures” Proc. Photonics West BIOS, Optical Interactions with Tissue and Cells XXIII, v8221, 82211J-1-J-9, San Jose, Jan. 2012.
  11. R.L.K. Cheng, M.J. Phang, R.M. Thomas, N. Pfeiffer, G.H. Chapman, B. Kaminska, “Fluorescence angular domain imaging of skin tissue phantoms using intralipid-infused solids”, Proc. Photonics West BIOS, Optical Interactions with Tissue and Cells XXIII, v8221, 822119-1-12, San Jose, Jan. 2012
  12. R. Qarehbaghi, W. Boonyasiriwat, and G.H. Chapman, “Bimetallic Gray-Scale Photomasks written using Flat-Top Beam vs. Gaussian Beam”, Proc. SPIE Photonics West, Laser Applications in Microelectronic and Optoelectronic Manufacturing VIII, v8243, 824305-1-12 San Francisco, Jan 2012.
  13. V.K. Jain and G.H. Chapman, “Enhanced Defect Tolerance Through Matrixed Deployment of Intelligent Sensors for the Smart Power Grid”, Proc. IEEE Int. Symposium on Defect and Fault Tolerance, pp 235-242, Vancouver, Canada, Oct. 2011.
  14. G.H. Chapman, J. Leung, A. Namburete, I. Koren and Z. Koren,“ Predicting pixel defect rates based on image sensor parameters”, Proc. IEEE Int. Symposium on Defect and Fault Tolerance, pp 408-416, Vancouver, Canada, Oct. 2011.
  15. G.H. Chapman, B. Gray, and V.K. Jain, “Creating Defect Tolerance in Microfluidic Capacitive/Photonic Biosensors”, Proc. IEEE Int. Symposium on Defect and Fault Tolerance, pp 181-189, Vancouver, Canada, Oct. 2011
  16. R. Qarehbaghi, G.H. Chapman, and W. Boonyasiriwat, “Improving the Accuracy of the Bimetallic Grayscale Photomasks Using a Feedback Controlled Flat-top Beam”, SPIE Photomask Technology, v 8166, 816641-1-41-12, Monterey, CA Sept. 2011
  17. G.H. Chapman, J. Leung, R. Thomas, I. Koren, and Z. Koren, “Tradeoffs in imager design parameters for sensor reliability”, Proc. Electronic Imaging, Sensors, Cameras, and Systems for Industrial/Scientific Applications XI, v7875, 78750I-1-I-12, San Francisco, Jan 2011
  18. P.V.R. Kalyanam, G.H. Chapman, and M. Parameswaran, “Simulating enhanced photo carrier collection in the multifinger photogate active pixel sensors”, Proc. Electronic Imaging, Sensors, Cameras, and Systems for Industrial/Scientific Applications XII, v 7875, 787508-1-8-12, San Francisco, Jan 2011
  19. R.L.K. Cheng, P.B.L. Tsui, G.H. Chapman and N. Pfeiffer, “Angular Domain Imaging of Fluorescence Sources within Tissue Phantoms, Proc. Photonics West BIOS, Optical Interactions with Tissue and Cells XXII, v7897, 78970W-1-W-12, San Jose, Jan. 2011
  20. R.L.K. Cheng, P.B.L. Tsui, G. Chiang, and G.H. Chapman, “Optical Imaging through Non-Transparent Small Aquatic Creatures with Angular Domain Imaging”, Proc. Photonics West BIOS, Optical Interactions with Tissue and Cells XXII, v7897, 78971X-1-X-9, San Francisco, Jan 2011
  21. J.M. Dykes, R. Qarehbaghi, and G.H. Chapman, “Bimetallic Grayscale Photomasks Written using Optical Density Feedback Control”, Proc. Photonics West, Laser Applications in Microelectronic and Optoelectronic Manufacturing VIII, v7927, 792719-1-9-12, San Francisco, Jan 2011
  22. G.H. Chapman, J. Leung, I. Koren, and Z. Koren, “Tradeoffs in imager design with respect to pixel defect rates” Proc. IEEE Int. Symposium on Defect and Fault Tolerance, 231-239, Kyoto, Japan Oct. 2010
  23. R.L.K. Cheng, P. Tsui, G.H. Chapman, N. Pfeiffer, and B. Kaminska, “Modeling of Fluorescence Sources within Tissue using Angular Domain Imaging”, Proc. Canadian Medical and Biological Engineering Conf. CMBEC33, June 2010
    [149] V.K. Jain and G.H. Chapman, “Massively Deployable Intelligent Sensors for the Smart Power Grid” Proc. IEEE Int. Symposium on Defect and Fault Tolerance, 319-327, Kyoto, Japan  Oct. 2010
  24. G.H. Chapman, B. Gray, and V.K. Jain, “Defect Tolerance in Microfluidic Chambers for Capacitive”, Proc., Photonics West, MOEMS-MEMS, Microfluidics, BioMEMS, and Medical Microsystems VIII, v7593, 75930V-1-0V11, San Francisco, Jan. 2010.
  25. F. Vasefi, E. Ng, M. Najiminaini, G. Albert, B. Kaminska, G.H. Chapman, and J.J.L. Carson, “Angular Domain Spectroscopic Imaging of turbid media using silicon micro-machined micro-channel arrays”, Proc., Photonics West, BIOS10, Imaging, Manipulation, and Analysis of Biomolecules, Cells, and Tissues VIII, v75681K-1-1K9, San Francisco, Jan. 2010
  26. F. Vasefi, E. Ng, M. Najiminaini, B. Kaminska, G.H. Chapman, H. Zeng, and J.J.L. Carson, “Angle-resolved diffused scattered light spectroscopy using radial angular filter arrays” Proc., Photonics West, BIOS10, Optical Interactions with Tissue and Cells XXI, v 7562, 756209-1- 09-7, San Francisco, Jan. 2010
  27. P.B. Tsui, G.H. Chapman. R. Cheng, G. Chiang, N. Pfeiffer, B. Kaminska, “Spatiofrequency filters for imaging fluorescence in scattering media”, Proc., Photonics West, BIOS10, Optical Interactions with Tissue and Cells XXI, v7562, 75620B1-0B12, San Francisco, Jan. 2010
  28. N. Pfeiffer, G.H. Chapman, and B. Kaminska, “Optical Imaging of Structures Within Highly Scattering Material Using an Incoherent Beam and a Spatial Filter”, Proc., Photonics West, BIOS10, Optical Interactions with Tissue and Cells XXI, v 7562, 756208-1- 08-11, San Francisco, Jan. 2010
  29. J. Leung, G.H. Chapman, Y.H. Choi, R. Thomson, I. Koren, and Z. Koren, “Analyzing the impact of ISO on digital imager defects with an automatic defect trace algorithm”, Proc., Electronic Imaging, Sensors, Cameras, and Systems for Industrial/Scientific Applications XI, v 7536, 75360F1-0F12, San Jose, Jan. 2010
  30. P.V.R. Kalyanam, G.H. Chapman, and M. Parameswaran, “Enhanced sensitivity achievement using advanced device simulation of multifinger photo gate active pixel sensors”, Proc., Electronic Imaging, Sensors, Cameras, and Systems for Industrial/Scientific Applications XI, v 7536, 75360G1-0G12, San Jose, Jan. 2010
  31. J. Leung, G.H. Chapman, I. Koren, and Z. Koren, “Automatic Detection of In-field Defect Growth in Image Sensors”, Proc. IEEE Int. Symposium on Defect and Fault Tolerance, 155-163, Chicago, MA Oct. 2009.
  32. J. Dykes, and G.H. Chapman, “Enhanced laser-writing techniques for bimetallic grayscale photomasks”, Proc. SPIE Photomask Technology, v 7488, pp 74880O1-0O12, Monterey, CA Oct. 2009.
  33. M. Najiminaini, F. Vasefi, B. Kaminska., G.H. Chapman, and J.J.L Carson,. Macroscopic fluorescent lifetime imaging in turbid media using angular filter arrays. The 30th Annual International Conference of IEEE EMBS 2009, pp 5364-5368. Minneapoli, Sept. 2009.
  34. F. Vasefi, B.S.L. Hung, B. Kaminska1, G.H. Chapman, and J.J.L. Carson, “Angular domain optical imaging of turbid media using enhanced micro-tunnel filter arrays”, Diffuse Optical Imaging II, v 7369, 73691N1-1N6, Munich, Germany, July 2009
  35. E. Ng, F. Vasefi, B. Kaminska, G.H. Chapman, and J.J. L. Carson, “Image contrast enhancement during time-angular domain imaging through turbid media by estimation of background scattered light”, Photonics West, BIOS09, Imaging, Manipulation, and Analysis of Biomolecules, Cells, and Tissues VII, v7182, 71821C1 – 1C12, San Jose, Jan 2009.
  36. J.M. Dykes and G.H. Chapman, “Optical Characterization of Mask Writing Process in Bimetallic Grayscale Photomasks” LASE09, Photonics West, Laser Applications in Microelectronic and Optoelectronic Manufacturing VII, v72010S1-0S12, San Jose, Jan 2009
  37. F. Vasefi, B. Kaminska, J.J.L. Carson, and G.H. Chapman, “Angular domain florescent lifetime imaging (ADFLIM) in turbid media”, BIOS09, Photonics West, Multiphoton Microscopy in the Biomedical Sciences IX, v71830I1-0I9, San Jose, Jan 2009
  38. F. Vasefi, B. Kaminska, J.J.L. Carson, and G.H. Chapman, “Effect of time gating and polarization discrimination of propagating light in turbid media in Angular Domain Imaging (ADI)”, Photonics West, BIOS09, Imaging, Manipulation, and Analysis of Biomolecules, Cells, and Tissues VII, v7182, 718217-1 – 17-10, San Jose, Jan 2009.
  39. F. Vasefi, B. Kaminska, J.J.L. Carson, K. Jordan and G.H. Chapman, “Angular domain optical projection in turbid media”, Photonics West, BIOS09, Optical Tomography and Spectroscopy of Tissues VIII, v 7174, 71740D1-0D10, San Jose, Jan 2009.
  40. F. Vasefi, B. Kaminska, J.J.L. Carson, and G.H. Chapman, “Angular distribution of quasi-ballistic light measured through turbid media using angular domain optical imaging” Photonics West, BIOS09, Optical Interactions with Tissue and Cells XX, v7175, 717509-1 – 09, San Jose, Jan 2009.
  41. P. Tsui, G.H. Chapman, R.L.K. Cheng, N. Pfeiffer, B. Kaminska, and F. Vasefi, “Spatiofrequency Filter in Turbid Medium Enhanced by Background Scattered Light Subtraction from a Deviated Laser Source”, Photonics West, BIOS09, Optical Interactions with Tissue and Cells XX, v. 7175, 71750A1-0A12, San Jose, Jan 2009
  42. J. Leung, M. La Haye, G.H. Chapman, J. Liu, P. Kalyanam, and M. Parameswaran, “The implementation and spectrum response analysis of multi-finger photogate APS pixels” Proceedings Electronic Imaging, Sensors, Cameras, and Systems for Industrial/Scientific Applications X, v7429, 742903-1 – 03-12, San Jose, Jan. 2009
  43. J. Leung, G.H. Chapman, Z. Koren, and I. Koren, “Statistical identification and analysis of defect development in digital imagers”, Electronic Imaging; Digital Photography V, v 7250, 72500W1-0W12, San Jose, Jan. 2009
  44. J. Dykes, P. Tsui, J. Leung and G.H. Chapman, “Effects of heated substrates on bimetallic thermal resist for lithography and grayscale photomask applications”, Proc. SPIE Photomask Technology, v 7122, pp 71220M1-M12, Monterey, CA Oct. 2008.
  45. G.H. Chapman and V. K. Jain, “Defect Tolerance for a Capacitance Based Nanoscale Biosensor”, Proc. IEEE Int. Symposium on Defect and Fault Tolerance, pp 305-313, Boston, MA Oct. 2008.
  46. J. Leung, G.H. Chapman, I. Koren, and Z. Koren, “Automatic Detection of In-field Defect Growth in Image Sensors”, Proc.  IEEE Int. Symposium on Defect and Fault Tolerance, 220-228, Boston, MA Oct. 2008.
  47. J. Leung, J. Dudasa, G.H. Chapman, Z. Koren, and I. Koren, “Characterization of pixel defect development during digital imager lifetime”, Electronic Imaging Sensors, Cameras, and Systems for Industrial/Scientific Applications IX, v 6816, 68160A-1- 0A12 San Jose, Jan 2008.
  48. J.M. Dykes, C. Plesa and G. H. Chapman, “Enhancing Direct-write Laser Control Techniques for Bimetallic Grayscale Photomasks”, SPIE Photonics West, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics, v 6883, pp 688312-1-12-12, San Jose, Jan 2008.
  49. N. Pfeiffer, P.K.Y. Chan,, G.H. Chapman, F. Vasefi and B. Kaminska, “Optical Imaging of Structures Within Highly Scattering Material Using a Lens and Aperture to Form a Spatiofrequency Filter”, Photonics West, Optical Interactions with Tissue and Cells XIX, v6854, pp 68541D1-1D12, San Jose, Jan 2008.
  50. F. Vasefi, G.H. Chapman, P.K.Y. Chan, B. Kaminska and N. Pfeiffer, “Enhanced Angular Domain Optical Imaging by Background Scattered Light Subtraction from a Deviated Laser Source”, Photonics West, Optical Interactions with Tissue and Cells XIX, v6854,  pp 68541E1-1E12, San Jose, Jan 2008.
  51. J. Dykes, P. Chan, G. Chapman and L. Shannon, “A Multiprocessor System-on-Chip Implementation of a Laser-based Transparency Meter on an FPGA”, Proc. Int. Conf. on Field Programmable Technology, pp 373-376, Kitakyushu, Japan, Dec. 2007
  52. J. Dudas, M. L. La Haye, J. Leung, G.H. Chapman, “A Fault-Tolerant Active Pixel Sensor to Correct In-Field Hot-pixel Defects”, Proc. IEEE Int. Symposium on Defect and Fault Tolerance, pp 526-534, Rome, Italy, Oct. 2007.
  53. J. Leung, J. Dudas, G.H. Chapman, I. Koren, and Z. Koren, “Quantitative Analysis of In-Field Defects in Image Sensor Arrays”, Proc. IEEE Int. Symposium on Defect and Fault Tolerance, pp 517-525, Rome, Italy, Oct. 2007.
  54. J.M. Dykes, C. Plesa, C. Choo, and G.H. Chapman, “Bimetallic Thermal Resists Potential for Double Exposure Immersion Lithography and Grayscale Photomasks”, Proc. SPIE BACUS Symposium on Photomask Technology, v6730, 673040-1 -673040-10, Monteray, CA, Sept. 2007.
  55. J. Dudas, C. Jung, M.L. LaHaye, and G.H. Chapman, “A Fault-Tolerant Active Pixel Sensor for Mitigating Hot Pixel Defects”, Proc. IEEE Canadian Conf. Elec. Comp. Eng. 2007, pg. 1445-1448, Vancouver, BC Apr. 2007.
  56. J. Wang, J.M. Dykes, C. Choo, D.K. Poon, M. Chang, J.T.K. Tsui, and G.H. Chapman, “Bimetallic Thin Film Grayscale Photomasks for Complex 3D Microstructure Creation in SU-8”, Proc. IEEE Canadian Conf. Elec. Comp. Eng. 2007, pg  959-962, Vancouver, BC Apr. 2007.
  57. J. Dudas, L.M. Wu, C. Jung, G.H. Chapman, Z. Korenb, and I. Koren, “Identification of in-field defect development in digital image sensors”, Proc. Electronic Imaging, Digital Photography III, v6502, 65020Y1-0Y12, San Jose, Jan 2007.
  58. P.K.Y. Chan, F. Vasefi, G.H. Chapman, B. Kaminska, and N. Pfeiffer, “Multispectral Angular Domain Optical Tomography in Scattering Media with Argon and Diode Laser Source”, Proc. Photonics West, Optical Interactions with Tissue and Cells XVIII, v6435,  64350M1-0M12, San Jose, Jan 2007.
  59. J.M. Dykes, D.K.Poon, C. Choo, J. Wang, J.T.K. Tsui, G.H. Chapman and Y. Tu, “Improved Writing Method of Bimetallic Grayscale Photomasks”, Proc. Photonics West, Photon Processing in Microelectronics and Photonics VI, v6458, 64580T1-0T12, San Jose, Jan 2007.
  60. J.M. Dykes, D.K. Poon, J. Wang, D. Sameoto, J.T.K. Tsui, C. Choo, G.H. Chapman, A.M. Parameswaren, and B.L. Gray, “Creation of embedded structures in SU-8”, Proc. SPIE Photonics West Microfluidics, BioMEMS, and Medical Microsystems V, v 6465, pp 64650N1-N12, San Jose, Jan 2007.
  61. F. Vasefi, P. K.Y. Chan, B. Kaminska, and G. H. Chapman, "Deep Illumination Angular Domain Imaging Within Highly Scattering Media Enhanced by Image Processing", Proc. SPIE Optics East: Smart Medical and Biomedical Sensor Technology IV, v 6380 63800Q1-Q12 Boston, MA Oct. 2006.
  62. M.L. La Haye, C. Jung, D. Chen, G.H. Chapman and J. Dudas, “Fault Tolerant Active Pixel Sensors in 0.18 and 0.35 Micron Technologies”, . IEEE Int. Symposium on Defect and Fault Tolerance., pp 448 – 456, Washington, DC Sept 2006
  63. J. Dudas, C. Jung, L. Wu, G.H. Chapman, I. Koren, and Z. Koren, “On-Line Mapping of In-Field Defects in Image Sensor Arrays”, Proc. IEEE Int. Symposium on Defect and Fault Tolerance, pp 439 - 447, Washington, DC Sept 2006
  64. V. K. Jain and G.H. Chapman, “Defect Tolerant and Energy Economized DSP Plane of a 3-D Heterogeneous SoC”,  IEEE Int. Symposium on Defect and Fault Tolerance, pp 157 – 165, Washington, DC Sept 2006
  65. D.K. Poon, J.M. Dykes, C. Choo, J.T.K. Tsui, J. Wang, G.H. Chapman, Y. Tu, P. Reynolds, and A. Zanzal, “Adding Grayscale Layer to Chrome Photomasks” Proc. SPIE BACUS Symposium on Photomask Technology, v6349, pp 634931-1-634931-12, Monteray, CA, Sept. 2006
  66. F. Vasefi; P.K.Y. Chan, B. Kaminska; G.H. Chapman, “Subsurface Bioimaging Using Angular Domain Optical Backscattering Illumination”, Proc. IEEE Engineering in Medicine and Biology Society, 2006. EMBS '06, pp:1932 – 1936, New York, NY Aug. 2006.
  67. G.H. Chapman, D. Poon, C. Choo, J. Wang, M. Chang, and Y. Tu, “Laser-induced Oxidation of Metallic Thin Films as a Method for Creating Grayscale Photomasks”, Proc. SPIE Microlithography Conf., v 6153, pp 61534G1-G12, San Jose, Feb. 2006.
  68. F. Vasefi, B. Kaminska, G. H. Chapman, and P.K.Y. Chan, “Angular Domain Imaging for Tissue Mapping” Proc. IEEE-EMBS Conf. on Bio-Micro and Nanosystems, pg. 39 – 45, San Franscisco, Jan. 2006.
  69. G.H. Chapman, J. Rao, T. Lui and N. Pfeiffer, “Enhanced Angular Domain Image in Turbid Medium using Gaussian Line Illumination”, Proc. SPIE Photonics West: Laser Interaction with Tissue and Cells XVII, v 6084, 60841D1-1D11,  San Jose, CA, Jan. 2006.
  70. J. Wang, M. Chang, Y. Tu, D. Poon, G.H. Chapman, C. Choo and J. Peng, “Laser-induced Oxidation of Zinc Film for Direct-write Grayscale Photomask Material”, Proc. SPIE Photonics West: Photon Processing in Microelectronics and Photonics V, v6106, pp 61060F1-0F11, San Jose, Jan. 2006.
  71. D. Poon, G.H. Chapman, C. Choo, M. Chang, J. Wang, and Y. Tu, “Real-Time Optical Characterization of Laser Oxidation Process in Bimetallic Direct Write Gray Scale Photomasks”, Proc. SPIE Photonics West: Photon Processing in Microelectronics and Photonics V, v6106, pp 61060G1-0G12, San Jose, Jan. 2006.
  72. M.L. La Haye, C. Jung, M.H. Izadi, G.H, Chapman, and K.S. Karim, “Noise Analysis of Fault Tolerant Active Pixel Sensors with and without Defects” Proc. SPIE Electronic Imaging, Sensors, Cameras, and Systems for Scientific/Industrial Applications VIII, v6068, 6068041-0411, San Jose, Jan 2006.
  73. J. Dudas, C. Jung , G.H. Chapman, I. Koren, and Z. Koren, “Robust Detection of Defects in Solid-State Imaging Arrays” Proc. SPIE Electronic Imaging, Image Quality and System Performance III, v6059, 60590X1-0X12, San Jose, Jan 2006.
  74. G.H. Chapman, V.K. Jain and S. Bhansali, “Inter-Plane Via Defect Detection Using the Sensor Plane in 3-D Heterogeneous Sensor Systems”, Proc. IEEE Defect and Fault Tolerance Conf., pp 158-156, Monteray, CA Oct. 2005.
  75. G.H. Chapman, I. Koren, Z. Koren. J. Dudas, and C. Jung, “On-Line Fault Identification in Fault-Tolerant Imagers”, Proc. IEEE Defect and Fault Tolerance Conf., pp 149-157, Monteray, CA Oct. 2005.
  76. C. Jung, M.H. Izadi, M.L. La Haye, G. H. Chapman, and K.S. Karim, “Noise Analysis of Fault Tolerant Active Pixel Sensors”, Proc. IEEE Defect and Fault Tolerance Conf., pp 140-148, Monteray, CA Oct. 2005.
  77. V. K. Jain, S. Bhanja, G. H. Chapman, L. Doddannagari, and N. Nguyen1, “A Highly Reconfigurable Computing Array: DSP Plane of a 3-D Heterogeneous Sensor”, Proc. IEEE Int. SOC Conf. 2005, pp 243-246, Washington, DC Sept 2005.
  78. G.H. Chapman, D. Poon, Y. Tu, J. Dykes, M. La Haye and J. Wang, “Expanding grayscale capability of direct write photomasks by using modified Bi/In compositions”, Proc. SPIE BACUS Symposium on Photomask Technology, v5992,  pp 59920K1-K11, Monteray, CA, Sept. 2005.
  79. W.R.Frisken, L.N.Hand, G.H.Chapman, J.Wang, C.-H.Choo, and Y.Tu, “Laser annealing experiments with niobium”, Proceedings of the 12th Biennial International Workshop on RF Superconductivity SRF2005, New York, USA, July.2005
  80. C. Hu, X. Qu, J.Q.M Wu, and G.H. Chapman, “MOS hydrogen sensor array for 2D gas distribution mapping”, Conf. of Metallurgists 2005, pp 497-504, Calgary, Canada, Aug., 2005.
  81. V.K. Jain, S. Bhansali, and G.H. Chapman; and; “Inter-layer Vias and TESH Interconnection Network for 3-D Heterogeneous Sensor System on a Chip”, Proc. SPIE Defense and Security Symposium 2005, Unattended Ground Sensor Technologies and Applications VII, v5796, pp 306-317, Orlando, FL, April 2005.
  82. V.K. Jain, S. Bhanja, G.H. Chapman, L. Doddannagari, N. Nguyen1, “A Parallel Architecture for the ICA Algorithm: DSP Plane of a 3-D Heterogeneous Sensor”, Proc. IEEE Int. Conf on Acoustics, Speech, and Signal Processing, v. 5,  pp 77-80, Philadelphia, PA, Mar. 2005.
  83. Y. Zhang, J. H. Choy, G. H. Chapman and K. L. Kavanagh, “Temporary Extrusion Failures in Accelerated Lifetime Tests of Copper Interconnects”, Proc. Materials Research Society Spring Conf. Symp. B Materials, Technology and Reliability of Advanced Interconnects, v 863, pg B9.7.1-B9.7.6, San Franscico, CA Mar. 2005.
  84. G.H. Chapman, D. Poon, C. Choo, Y. Tu, J. Wang, J. Peng, W. Lennard and K. Kavanagh, “Enhanced Inorganic Bimetallic Thermal Resists Transparency and Resolution for Photomask Fabrication”, Proc. SPIE Microlithography, Advances in Resist and Processing XXII, v5753, pp 976-987, San Jose, Mar. 2005.
  85. G.H. Chapman, P.K.Y. Chan, J. Dudas, J. Rao and N. Pfeiffer, “Angular Domain Image Detectability with Changing Turbid Medium Scattering Coefficients”, Proc. SPIE Photonics West: Laser Interaction with Tissue and Cells XVI, v, 5695, pg 160-171, San Jose, CA, Jan. 2005.
  86. N. Pfeiffer, and G.H. Chapman, “Monte Carlo Simulations of the Growth and Decay of Quasi-Ballistic Photon Fractions with Depth in an Isotropic Medium” ”, Proc. SPIE Photonics West: Laser Interaction with Tissue and Cells XVI, v, 5695,    pg 136-147, San Jose, CA, Jan. 2005.
  87. G.H. Chapman, J. Dykes, D. Poon, C. Choo, J. Wang, Y. Tu, and J. Peng, “Creating Precise 3D Microstructures Using Laser Direct-write Bimetallic Thermal Resist Grayscale Photomasks”, Proc. SPIE Photonics West: Photon Processing in  Microelectronics and Photonics IV, v 5713, pg. 247-258, San Jose, Jan. 22, 2005.
  88. C. Jung, G.H. Chapman, M.L. La Haye, S. Djaja, D.Y.H. Cheung, H. Lin, E. Loo, Y. Audet, “Fault Tolerant Photodiode and Photogate Active Pixel Sensors”, Proc. SPIE Electronics Imaging, Sensors and Camera Systems for Scientific and Industrial Applications VI, v 5677, pp. 78-89, San Jose,  Jan. 15, 2005.
  89. G.H. Chapman, V. Jain and S. Bhansali , “Defect Avoidance in a 3-D Heterogeneous Sensor”, Proc. IEEE Intern. Symposium on Defect and Fault Tolerence in VLSI Systems, pg. 67-75, Cannes, France Oct. 2004.
  90. M.L. La Haye, G.H. Chapman, C. Jung, D.Y.H. Cheung, S. Djaja, and Y. Audet, “Characteristics of Fault-Tolerant Photodiode and Photogate Active Pixel Sensor (APS)”, Proc. IEEE Intern. Symposium on Defect and Fault Tolerence in VLSI Systems, pg. 58-66, Cannes, France Oct. 2004.
  91. J. Peng, Y. Tu and G.H. Chapman, “Laser direct write Indium tin oxide films for inorganic resist patterning and photomask”, SPIE Photonics North 2004, v 5578, pg 620-631, Ottawa, Sept. 2004
  92. Y. Tu, G.H. Chapman J. Peng, J. Dykes, and D. Poon, “Calibrating Gray-scale Direct Write Bimetallic Photomasks to Create 3D Photoresist Structures”, Proc. SPIE BACUS Symposium on Photomask Technology 24th annual, v 5567,  pg 245-256, Monteray, CA, Sept. 2004
  93. S. Bhansali, G. H. Chapman; E. G. Friedman; Y. Ismail; V. K. Jain; and P. R. Mukund, “3-D Heterogeneous Sensor System on a Chip”, Proc. SPIE Defense and Security Symposium 2004, Unattended/unmannded Ground, Ocean and Air Sensor Technologies and Applications VI, v5417, pg 413-424, Orlando, FL, April 2004.
  94. G.H. Chapman, Y. Tu, J. Peng, “Inorganic Bi/In Thermal Resist as a High Etch Ratio Patterning Layer for CF4/CHF3/O2 Plasma Etch”, Proc. SPIE Microlithography Conference Advances in Resist Technology and Processing XXI, v 5376, pg 867-878, Santa Clara, CA, Feb. 2004.
  95. N. Pfeiffer,  B. Wai, and G.H. Chapman,” Angular Domain Imaging of phantom objects within highly scattering mediums”  Proc. SPIE   Photonics West: Laser Interaction with Tissue and Cells XV, v 5319, San Jose, CA pp. 135-145, San Jose,  Jan. 2004
  96. G.H. Chapman, Y. Tu, J. Peng, “Creating 3D Structures with A Direct-Write Gray Scale Photomask Made From Sn/In Bimetallic Films”, Proc. SPIE Photonics West: Laser Applications in Microelectronics and Optoelectronics Manufacturing IX, v 5342, pg 192-203, San Jose, Jan. 2004
  97. G.H. Chapman, D.Y.H. Cheung, S. Djaja, Y. Audet, C. Jung, and B. Wai, “Fault Tolerant Active Pixel Sensors for Large Area Digital Imaging Systems”, Proc. SPIE Photonics West, Optoelectronic Integrated Circuits VIII , v 5356, pg 142-153, San Jose,  Jan. 2004.
  98. G.H. Chapman and Y. Tu, “Bi/In Thermal Resist for Both Si Anisotropic Wet Etching and Si / SiO2 Plasma Etching”, Proc. SPIE Micro04, Photonics West, Micromachining and Microfabrication Process Technology IX, San Jose,  Jan. 2004
  99. V. Jain, and G.H. Chapman, “Level-Hybrid Optoelectronic TESH  Interconnection Network”, Proc IEEE Intern. Symposium on Defect and Fault Tolerence in VLSI Systems, pg 45-52, Boston, MA, Nov. 2003.
  100. D.Y.H. Cheung, G.H. Chapman, S. Djaja and Y. Audet, “Implementation and Testing of Fault-Tolerant Photodiode-based Active Pixel Sensor (APS)”,Proc. IEEE Intern. Symposium on Defect and Fault Tolerence in VLSI Systems, pg. 53-60, Boston, MA, Nov. 2003.
  101. G.H. Chapman, Y. Tu, J. Peng, “Creating Gray-scale Photomasks with Bimetallic Thin Film Thermal Resists”, Proc. SPIE Bacus 2003, v, 5256, pg 400-411, Monteray, CA, Sept. 2003.
  102. G.H. Chapman, Y. Tu, J. Peng, “Wavelength Invariant Bi/In Thermal Resist As A Si Anisotropic Etch Masking Layer And Direct Write Photomask Material”, Proc. SPIE Microlithography Conference, Advances in Resist Technology and Processing XX, v5039, pg 472-483, Santa Clara, CA, Feb. 2003.
  103. G.H. Chapman, M. Trinh, G. Chou, N. Pfeiffer and D. Lee, "Optical imaging objects within highly scattering material using Silicon Micromachined Collimating Arrays", SPIE Photonics West, Optical Tomography and Spectrocopy of Tissue V, San Jose, (BIOS) v4955, pg 464-473, Jan. 2003.
  104. G.H. Chapman, Y. Tu, “Single Step Direct-Write Photomask Made From Bimetallic Bi/In Thermal Resist”, Proc. SPIE LASE 2003 Photonics West, Photon Processing in Microelectronics and Photonics II, v4977, pg 257-268, San Jose, Jan 2003.
  105. Y. Tu, G.H. Chapman “Bi/In as Patterning and Masking Layers for Alkaline-Base Si Anisotropic Etching” Micro03, Photonics West 2003, Micromachining and Microfabrication Process Technology VII, v 4979, pg 87-98, San Jose, Jan. 2003
  106. Y. Tu, M. Karimi, N. Morawej, W. Lennard, J. Peng, K. L. Kavanagh, and G. H. Chapman “Wavelength Invariant Resist composed of Bimetallic Layers”,  Proc. Novel Materials and Processes for Advanced CMOS. Symposium , Materials Research Soc. Conf., v745, pg 73-78, Boston, Dec. 2002
  107. Y. Tu, G.H. Chapman, "Bi/In: A Novel Bimetallic Thermal Resists for Optical and Micromachining Applications", SPIE OptoCanada 2002, Abstract only published, Ottawa May 2002
  108. G.H. Chapman, Y. Tu, and M.V. Sarunic " Bi/In Bimetallic Thermal Resists for Microfabrication, Photomasks and Micromachining Applications", Proceedings SPIE Microlithography Conference, Advances in Resist Technology and Processing XIX, v4690, 12 pages, San Josa, CA 2002.
  109. G.H. Chapman, M.S. Tank, G. Chou and M. Trinh "Optical imaging objects within highly scattering mediums using Siliocn Micromachined Collimating Arrays", Proceedings SPIE Photonics West, BIOS Optical Fibers and sensors in Biomedical Applications II (BO10), v4616, pg  187-198,  San Josa, CA Jan. 2002.
  110. Y. Tu, G.H. Chapman, and M.V. Sarunic "Bimetalltic Thermall Activated films for Microfabrication, Photomasks and Data Storage", Proceedings SPIE Photonics West, Laser Applications in Microelectronics and Optoelectronics Applications, v4637, pg 330-340, San Josa, CA 2002.
  111. G.H. Chapman, M.V. Sarunic, Y. Tu, "A Prototype Laser Activated Bimetallic Thermal Resist for Microfabrication", SPIE Proceedings Laser Applications in Microelectronics and Optoelectronics Applications, v 4274, pg 183-193, San Josa, CA 2001
  112. M.V. Sarunic, G.H. Chapman, Y. Tu, "BiIn: a Sensetive Bimetallic Thermal Resist", SPIE Advances in Resist Technology and Processing XVIII v. 4345, pg 557-567, Santa Clara, CA Mar 2001
  113. I. Koren, G.H. Chapman, and Z. Koren, "Advanced Fault-Tolerance Techniques For a Color Digital Camera-On-A-Chip", IEEE Intern. Symposium on Defect and Fault Tolerence in VLSI Systems, pg 3-10, San Francisco, CA. Oct. 2001
  114. Y. Audet and G.H. Chapman, "Design of a Self-Correcting Active Pixel Sensor", Intern. Symposium on Defect and Fault Tolerence in VLSI Systems, pg 18-27, San Francisco, CA. Oct. 2001
  115. G.H. Chapman, N. Pfeiffer,  "A Comparison of Microfabrication and Wakeshield's processing Requirements", Proceedings AIAA ISS Utilization 2001,  CD version, 11 pages Orlando, FL 2001.
  116. N. Pfeiffer, G.H. Chapman, "Silicon Wafer Transport in a High Vacuum, Microgravity Environment, Proceedings Spacebound 2000, CD version 23 pages, June 2000.
  117. G. H. Chapman N. Pfeiffer, J. S. Johnson, "Synergy of Combining Microfabrication Technologies in Orbit, Proceedings  Spacebound 2000, CD version 13 pages, June 2000.
  118. J. S. Johnson, G.H. Chapman, N. Pfeiffer, "Economic Analysis of a Semiconductor Factory Satellite", Proceedings AIAA Space 2000, CD version 11 pages, Sept. 2000
  119. I. Koren, G.H. Chapman, and Z. Koren, "A Self-Correcting Active Pixel Camera", Proceedings IEEE Intern. Symposium on Defect and Fault Tolerence in VLSI Systems, Yamanashi, Japan, pg 56-64 Oct. 2000.
  120. G.H. Chapman and Y. Audet, "Creating 35 mm Camera Active Pixel Sensors", Proceedings Intern. Symposium on Defect and Fault Tolerence in VLSI Systems, Albuquerque, NM, pg 22-30, Nov. 1999.
  121. M. Tank and G.H. Chapman, "Micromachined Silicon Collimating Detector Array to View Objects in Hightly Scattering Medium", Canadian Workshop on MEMS, Ottawa, Canada, Aug. 13, 1999
  122. G.H. Chapman, "FPGA Design for Decimeter Scale Integration (DMSI)", IEEE Intern. Symposium on Defect and Fault Tolerence in VLSI Systems, pg. 64-72, Austin 1998.
  123. G.H. Chapman, "Laser Applications to IC Defect Correction", Proceedings SPIE Photonics West: Lasers as Tools for Manufacturing of Durable Goods and Microelectronics, v 3274, pg 79-89, San Jose, 1998
  124. G.H. Chapman, and D.E. Bergen, "A High Speed Lensless Integrated Proximity Sensor", Proceedings IEEE Int'l Conf. on Innovative Systems in Silicon, pg 126-135, Oct. 1997.
  125. G.H. Chapman and Benoit Dufort, "Laser Defect Correction Application to FPGA Based Custom Computers" Proceedings IEEE FPGA's for Custom Computing Machines (FCCM'97), pg 240-241, Napa Valley CA (1997).
  126. G.H. Chapman and B. Dufort, "Laser Correcting Defects to Create Transparent Routing for Large Area FPGA's", Procceedings ACM/SIGDA Int. Symposium on FPGA'97, pg 17-24, Monterey CA (Feb. 1997).
  127. G.H. Chapman, N. Sawadsky and P.P.S. Juneja, "Phase sensitive techniques applied to a micromachined vacuum sensor", Proc. SPIE Micromachined Devices and Components Conf., v 2882, pg 266-277, Austin, TX, (Oct. 1996)
  128. G.H. Chapman and B. Dufort, "Making Defect Avoidance Nearly Invisible to the User in Wafer Scale Field Programmable Gate Arrays", Proceedings IEEE International Symposium on Defect and Fault Tolerence in VLSI Systems, pg 11- 19, Boston, MA, (Nov. 1996).
  129. Y. Audet and G.H. Chapman, "Effects of Scanning and Biasing Circuit Restructuring on the Calibration of Large Area Magnetic Field Sensor Array", Proceedings IEEE Int'l Conf. on Innovative Systems in Silicon 1996, pg 61-70, Austin, TX, (Oct. 1996).
  130. G.H. Chapman, D.E. Bergen, T. Singh and T.S. Weeks, "Laser Hole Drilling in Thick Polypropylene sheets for Proximity Sensors", Lasers as Tools for Manufacturing of Durable Goods and Microelectronics, San Jose, SPIE Proceedings v2703, pg 421-429 (1996)
  131. G.H. Chapman, D.E. Bergen and K. Fang, "Wafer-Scale Integration Defect Avoidance Tradeoffs between Laser Links and Omega Network Switching", Int. Workshop on Defect and Fault Tolerance pg 37-45, Lafayette, LA (1995)
  132. Y. Audet and G.H. Chapman, "Robust Design of a Large Area Magnetic Field Sensor Array", Proc. IEEE Int. Conf. on Wafer-Scale Integration '95, 207-216, San Francisco (1995).
  133. B. Dufort and G.H. Chapman, "Test Vehicle for a Wafer-Scale Field Programmable Gate Array", Proc. IEEE Int. Conf. on Wafer-Scale Integration '95, 33-42, San Francisco (1995).
  134. G.H. Chapman, "Laser Processes for Defect Correction in Large Area VLSI Systems", invited paper, Proceedings IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems, 106-114, Montreal (1994).
  135. G.H. Chapman, "A Review of Micromachining and Microsensors", invited paper, Canadian Assoc. Physicists Congress, Phys. in Canada, v. 50, 3, pp. 83, June (1994).
  136. M.J. Syrzycki, M. Parameswaran, and G.H. Chapman, "Integrated Transducer Systems", Proceedings Czujniki Optpelecktroniczne I Eleektroniczne, Warsaw, Poland, May 22-25 1994, Proceedings SPIE, v 2634, 2-15 (1995)
  137. G.H. Chapman, M.J. Syrzycki, L. Carr, and B. Dufort, "Test Vehicle for a Wafer-Scale Thermal Pixel Scene Simulator", Proc. IEEE Int. Conf. on WaferScale Integration '94, 1-10, San Francisco (1994).
  138. G.H. Chapman and K. Fang, "Comparison of Laser Link Crossbar and Omega Network Switching for Wafer-Scale Integration Defect Avoidance", Proc. IEEE Int. Conf. on Wafer-Scale Integration '94, 352-361, San Francisco (1994).
  139. Y. Audet and G.H. Chapman, "Design of a Large Area Magnetic Field Sensor Array", Proc. IEEE Int. Conf. on Wafer-Scale Integration '94, 273-281, San Francisco (1994).
  140. P.P.S. Juneja and G.H. Chapman, "A Wide-Range Vacuum Sensor using Phase- Sensitive Detection", Proceedings of CCVLSI'93, 3A 7-12, Banff, Alb (1993).
  141. Y. Audet and G.H. Chapman, "Sensitivity Optimization of Double Drain/Double Source and Triple Drain/Triple Source MOS Magnetic Field Sensors", Proceedings of CCVLSI'93, 7:40-44, Banff, Alb (1993).
  142. G.H. Chapman & R.F. Hobson, "Algorithmic Bus and Circuit Layout for Wafer-Scale Integration and Multichip Modules", Int'l Conf. on Wafer Scale Integration, 137-146, San Francisco, CA (1993).
  143. M.J. Syrzycki, L. Carr, G.H. Chapman, and M. Parameswaran, "A Wafer-Scale Visual-to-Thermal Converter", International Conf. on Wafer Scale Integration, 1-10, San Francisco, CA (1993).
  144. Stoev, I., Surzycki, M., Parameswaran, M., Chapman, G., and Rawicz, A. "Process Optimization for Micromachined Silicon Non-Reverse Valve", Sixth Canadian Semiconductor Technology Conference, Ottawa, (1992) (conference abstract)
  145. V. Ward, M.J. Syrzycki, and G.H. Chapman, "CMOS Photodetector with Built- In Light Adaptation Mechanism," Canadian Conf. on VLSI '92, 164-171 (1992). (Also printed as Journal pub.)
  146. G.H. Chapman, M. Parameswaran, and M.J. Syrzycki, "A Wafer Scale Dynamic Thermal Scene Generator", Proc. International Conf. on Wafer Scale Integration, San Francisco, CA, 300-309 (1992).
  147. G.H. Chapman, "Laser Interconnection Techniques for Defect Avoidance in Large Area Restructurable Silicon Systems", Canadian Conf. on VLSI '91 4B1.1- 4B1.8 (1991) (Also printed as Journal publication)
  148. G.H. Chapman, "Space: the Ideal Place to Manufacture Microchips", Proc. of Inter. Space Development Conf. '91, 25-32, San Antonio, Texas (1991).
  149. G.H. Chapman, M.J. Syrzycki, M. Parameswaran, and P.P.S. Juneja, "Development of a Standard Transducer Cell Library for ASIC's", Proc. 4th Inter. Forum on ASIC's and Transducer Technology, Leuven, Belgium, 179-189 (1991).
  150. G.H. Chapman, and S.S. Cohen, "Reduced Laser Power for Aluminum Film Damage Using Multiple Pulses", Tech. Proc. of the Conf. on Lasers and Electro-optics, Baltimore, MD, 392-393 (1989).
  151. G.H. Chapman, J.I. Raffel, J.M. Canter and R.M. Rhodes "Advances in Laser Link Technology for Wafer-Scale Circuits", in "Wafer Scale Integration II: Proceedings of the Second I.F.I.P Workshop on Wafer Scale Integration", R.M. Lea editor, North-Holland, Oxford, 217-225 (1988).
  152. G.H. Chapman, J.M. Canter, and S.S. Cohen, "The Technology of Laser Formed Interactions for Wafer-Scale Integration", Proc. International Conf. on Wafer Scale Integration, ed. E. Swartzlander and J. Brewer, 21-29, San Francisco, CA (1989).
  153. T.O. Herndon, J.A. Burns, G.H. Chapman, and J.I. Raffel, "Multilevel interconnect planarization by voltage and laser programmable links using ion implantation", Proc. Sixth IEEE VLSI Multilevel Interconnect Conf., 322-328, Santa Clara, CA, (1989)
  154. J.M. Canter, G.H. Chapman, and J.I. Raffel, "A Laser-Diffused Link for Wafer-Scale Integration Using Standard CMOS Processing", Conf. on Lasers and Electro-optics Tech. Digest, Anaheim, CA (1988).
  155. G.H. Chapman, and J.A. Burns, "Enhanced Operation of Wafer-Scale Circuits Using Nitrided a-Si Laser Links", Tech. Digest of the Conf. on Lasers and Electro-optics, 270, Baltimore, CA (1987).
  156. J.A. Burns, G.H. Chapman, and T.O. Herndon, "Applications of Plasma- Deposited SiN to Wafer-Scale Integrated Circuits", Device Research Conf., Santa Barbara, (1987).
  157. T.O. Herndon, J.A. Burns, and G.H. Chapman, "Amorphous Silicon from Silicon Nitride by Ion Implantation", Electrochemical Society Conf. Extend abstracts, Honolulu, Hawaii (1987)
  158. G.H. Chapman, and J.A. Burns, "Silicon Nitride as a Protection Layer for Laser Linked Wafer Scale Integration", Tech. Digest of the Conf. on Lasers and Electro-optics, 148, San Francisco, CA (1986).
  159. G.H. Chapman, "Laser Linking Technology for VLSI", in "Wafer Scale Integration", C. Jesshope, and W. Moore, Editors, Adam Higer, Bristol and Boston pub., Bristol, 204-215 (1986).
  160. G.H. Chapman, B.L. Emerson, and J.I. Raffel, "Applications of Laser Linking to Wafer-Scale Integration", Invited Paper Materials  Research Society Fall Secession, Proceedings Symposium D; Beam-Induced Chemical Process, Boston, Ma (1985).
  161. B. Mathur, J.A. Burns, and G.H. Chapman, "Improvement of the AC Characteristics of an Amorphous Silicon-RVLSI Link Insulator by Hydrogenation", Electronic Materials Conference Digest (1984).
  162. P.W. Wyatt, J.I. Raffel, G.H. Chapman, B. Mathur, J.A. Burns, and T.O. Herndon, "Process Considerations in Restructurable VLSI for Wafer-Scale Integration", Proc. of Int. Elect. Dev. Meet., 626, San Francisco, CA (1984).
  163. G.H. Chapman, A.H. Anderson, K.H. Konkle, B. Mathur, J.I. Raffel, and A.M. Soares, "Interconnection and Testing of a Wafer-scale Circuit via Laser Processing", Confer. on Lasers and Electro-Optics Tech. Digest, 222, Anaheim, CA (1984).
  164. J.I. Raffel, A.H. Anderson, G.H. Chapman, K.H. Konkle, B. Mathur, A.M. Soares, and P.W. Wyatt, "A Wafer-Scale Digital Integrator", IEEE Int. Conf. on Computer Design, 121-125, Port Chester, NY (1984).
  165. J.I. Raffel, A.H. Anderson, G.H. Chapman, S.G. Garverick, K.H. Konkle, B. Mathur, and A.M. Soares, "A Wafer-Scale Digital Integrator", Proc. IEEE Int. Sym.on Circuits and Systems, 781-784, May (1983).
  166. G.H. Chapman, J.I. Raffel, J.A. Yasaitis, and S.M. Cheston, "Laser Linking for Restructurable VLSI", Conf. on Lasers and Electro-optics Tech. Digest, 60-63, Phoenix, AZ (1982).
  167. J.I. Raffel, M.L. Naiman, R.L. Burke, G.H. Chapman, and P.G. Gottschalk, "Laser Programmed Vias for Restructurable VLSI", Int. Elect. Dev. Meet. Tech. Digest, 132-135, Washington, DC (1980).
  168. G.H. Chapman, B.K. Garside and J. Shewchun, "Bandgap and Lattice Constants of the Pentenary Semiconductor Systems Cu(1-y) Ag(y) In S2(1-x) Se(2x), Canadian Ass. of Phys., London, Ont. paper BG9 (1978) (Abstract only).
  169. J.J. Loferski, J. Shewchun, B. Roessler, R. Beaulieu, J. Piekoszewski, M. Gorska, and G.H. Chapman, "Investigation of Thin Film Cadmium Sulfide/Mixed Copper Ternary Heterojunction Photovoltaic Cells", Proceeding of the 13th IEEE Photovoltaic Specialists Conf., 190- (1978).
  170. G.H. Chapman and D.L. Atherton, "The Production and Testing of Pico-ohm Resistance Joints Between Supercondutors", Canadian Ass. of Phys./CAS Congress, paper AE9, St. Johns, Nfd (1974). (Abstract only).

Book Chapters

  1. S.S. Cohen and G.H. Chapman, "Laser Beam Processing and Wafer-Scale Integration", Chapter 2, pg 19-111 in "Beam Processing Technologies", N.G. Einspruch, S.S. Cohen and R.N. Singh, ed., Academic Press, New York, 1989.
  2. J.I. Raffel, A.H. Anderson, and G.H. Chapman, "Laser Restructurable Technology and Design", Chapter 7, pg 319-363 in "Wafer Scale Integration", E. Swartzlander, ed., Kluwer Academic, 1988.

Patents

  1. G. Chapman, I. Koran, Z. Koran, J. Dudas and C. Jung, “Identification of Faults in Imager Arrays from Images Taken During Normal Operation”, US provisional patent application Sept. 30, 2005
  2. G. Chapman, M. Sarunic, Y. Tu, "Dry Multilayer Inorganic Alloy Thermal Resist for Lithographic Mask Creation", US patent applied for Sept  2003
  3. G. Chapman, M. Sarunic, Y. Tu, "Dry Multilayer Inorganic Alloy Thermal Resist for Lithographic Processing and Image Creation", European patent applied for Mar. 2003 (licenced to CREO Products).
  4. G. Chapman, M. Sarunic, Y. Tu, "Dry Multilayer Inorganic Alloy Thermal Resist for Lithographic Processing and Image Creation", Singapore patent applied for Mar. 2003 (licenced to CREO Products).
  5. G. Chapman, M. Sarunic, Y. Tu, "Dry Multilayer Inorganic Alloy Thermal Resist for Lithographic Processing and Image Creation", Japanese patent applied for Mar. 2003 (licenced to CREO Products).
  6. G. Chapman, Y. Audet, I. Koran and Z. Koran, "Active Pixel Sensor with built in Self Repair and Redundancy", US Patent Application Apr. 2003
  7. G. Chapman and M. Zaacks, "Antitheft Electrical Power Cord", Japanese Patent application April. 2002.
  8. G. Chapman and M. Zaacks, "Antitheft Electrical Power Cord", European Patent Coperation Tready application May 2002.
  9. G. Chapman and M. Zaacks, "Antitheft Electrical Power Cord", Sinapore patent No. 86830 granted May 31, 2004 (licenced to Parvonis Research)
  10. G. Chapman, M. Sarunic, Y. Tu, "Dry Multilayer Inorganic Alloy Thermal Resis for Lithographic Processing and Image Creation", Patent Cooperation Treaty international patent applied for Aug. 2001 (licenced to CREO Products).
  11. G. Chapman, Y. Audet, I. Koran and Z. Koran, "Active Pixel Sensor with built in Self Repair and Redundancy", PCT Patent Application Nov. 2001
  12. G. Chapman and M. Zaacks, "Antitheft Electrical Power Cord", Patent Cooperation Treaty international patent approved Aug. 2001.
  13. G. Chapman, M. Sarunic, Y. Tu, "Dry Multilayer Inorganic Alloy Thermal Resist for Lithographic Processing and Image Creation", US patent 6,641,978 issue Nov. 4, 2003
  14. G. Chapman and M. Zaacks, "Antitheft Electrical Power Cord", US. patent 6,150,940 issued Nov.21, 2000.
  15. G. Chapman and G Immega, "Vision System and Proximity Detector", German application under Patent Cooperation Treaty (assigned to Canadian Space Agency, licensed by KSI) July 1998.
  16. G. Chapman and G Immega, "Vision System and Proximity Detector", French application under Patent Cooperation Treaty (assigned to Canadian Space Agency, ) July 1998.
  17. G. Chapman and G Immega, "Vision System and Proximity Detector", UK application allowed 1999 (assigned to Canadian Space Agency, )..
  18. G. Chapman and G Immega, "Vision System and Proximity Detector", Patent Cooperation Treaty international patent allowed (assigned to Canadian Space Agency, ) July 24, 1997. G. Chapman and G Immega, "Vision System and Proximity Detector", Canadian patent application (assigned to Canadian Space Agency, ) 1996.
  19. G. Chapman and G Immega, "Vision System and Proximity Detector", USA patent, 5,726,443, issued March 10, 1998 (assigned to Canadian Space Agency).
  20. G. Chapman and G Immega, "Vision System and Proximity Detector", Canadian patent application (assigned to Canadian Space Agency) 1997.
  21. G.H. Chapman and T.O. Herndon, "Selectively Programmable Interconnections in Multilayer Integrated Circuits", U.S.A. Patent number 5,087,589 issued Feb. 11, 1993.
  22. T.O. Herndon, and G.H. Chapman, "Fabrication of Interlayer Conductive Paths in Integrated Circuits", Canadian Patent number 1286795, issued Jul 23 1991.
  23. T.O. Herndon, and G.H. Chapman, "Fabrication of Interlayer Conductive Paths in Integrated Circuits", U.S.A. Patent 4,843,034 issued Jun. 27, 1989.
  24. J.I. Raffel, J.A. Yasaitis, G.H. Chapman, M. L. Naiman, and J. A. Burns, "Method of Forming Conductive Path by Low Power Laser Pulse", U.S.A. Patent 4,810,663 issued Mar. 7, 1989.
  25. J.I. Raffel, J.A. Yasaitis, and G.H. Chapman, "Method and Apparatus for Forming Low Resistance Lateral Links in a Semiconductor Device", U.S.A. Patent 4,636,404 issued Jan. 13, 1987. * This Patent has been licensed by Lightspeed Semiconductor, a startup company whose main product is based on this process. MIT and the inventors are receiving equaty in the company and cash payments for its use.
  26. J.I. Raffel, J.A. Yasaitis, and G.H. Chapman, "Method of Making A Conductive Path in Multi-Layer Metal Structures by Low Power Laser Beam", U.S.A. Patent 4,585,490 issued Apr. 29, 1986.

Commissioned Technical Reports

  1. "Vision Skin Final Report" for the Canadian Space Agency and Kinetic Sciences Inc. under STEAR Phase II (Contract: 9F006-2-0654/000/A), 321 pages. Published in confidential (vol. 3) and public versions (vol 1, 2) by the CSA.

Thesis

G.H. Chapman, “Production and Testing of Pico Ohm Resistance in Joints Between Superconductors”, MSc thesis, Queens University, Kingston, Ont. Canada 1975
G.H. Chapman, “Cu(1-y)AgyIn S2(1-x)Se2x as a Prototype of the Pentenary Chalcopyrite Semiconductor Systems”, PhD thesis, McMaster University, Hamilton, Ont. Canada, 1982
 

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